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技术能力与品质要求

明阳电路了解持续投资于技术和设施的重要性。我们拥有先进的设备,如直接成像,垂直连续电镀,在线AOI,真空辅助环氧填充,喷雾涂布机,XACT注册系统。我们与供应商和客户一起进行研发,开发新的工艺、材料和技术。

部门 制程 设备

制前工程

文件读入

Frontline InPlan Planning Software

CAM制作

Orbotech Genesis 2000

光绘菲林

PR212-NT EIE photo plotter
Orbotech LP-9 R5 photo plotter

内层

内层湿膜

GRC-7N Automatic Wet Film Coater
6RC-7N Automatic Wet Film Coater

内层曝光

Various manual and semi-auto exposure

内层显影蚀刻

Universal DES( Develop-Etch-Strip) Lines

AOI自动光学检测

Orbotech Discovery, Camtek

棕化

Universal Alternative Oxide Line

压合

Burkle, OEM, Heng-da Vacumm Presses

钻孔

机械钻孔

Hitachi, Schmoll, HanHitachi,Mitsubishi

镭射钻孔

Hitachi LC-2G212E/2C Laser Drill

外层

等离子清洗

ReBorn RPP-V13

沉铜

Automatic Desmear and Electroless Copper

半自动曝光

5KW Manual Exposure

(内外层)LDI激光直接成像

Orbetech Paragon SM20 Laser Direct
Imaging photeck

全板电镀

Automatic Panel Plating Line
Automatic Pattern Plating Line
MCP-PAL Vertical Continuous Plating Line
Copper Via Fill Plating Tank

外层蚀刻

Universal SES( Strip-Etch-Tin Strip) Line

阻焊及文字

阻焊涂饰

Horizontal Semi Automatic Coater
Argus 9524S Solder Mask Spray Coater

阻焊曝光

Various SM Exposure ORC DI,orbotech diamond8

字符印刷

Orbotech Sprint 100

成型

数控外形

CNC Routers

V-Cut

CNC V-score

模冲外形

Hydraulic Punch

表面处理

有铅喷锡

Tin/Lead HASL

无铅喷锡

Lead Free HASL

沉金

Uyemura

沉镍钯金

Uyemura

沉银

MacDermid(Planar), Sub-contract

沉锡

Atotech(Stannatech)

防氧化

Shikoku(Glicoat-SMD F2)

镀硬金

Full body gold, gold fingers and selective gold

Soft Gold Flash

Full body and selevtive bondable soft gold

测试与终检

测试架测试

Fxiture Systems

飞针测试

Flying Probe Test

可靠性测试

X-section and Microscopes, Impendence Test, High-Pot

Tg Test, Peel Strength, lonic Testing, IR Reflow, Thermal Chamber etc chrommotography