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technology and quality

Sunshine’s Research and Development Department conducts research and development utilizing a wide range of equipment, materials, chemistries, software systems and new technologies as it relates to the manufacturing of the printed circuit board. Our research development utilizes a strategic proactive approach designed to facilitate the growth of the organization. This approach creates and develops technological strategies to increase competitiveness and provide inroads to new and existing marketplaces.

Preferred Materials

FR4 Standard Tg

Shengyi, ITEQ, KB, Nanya

FR4 Mid Tg (Lead Free Compatible)

Shengyi S1000, ITEQ IT158

FR4 High Tg (Lead Free Compatible)

Shengyi S1000-2, S1170
EMC EM827
Isola 370HR
ITEQ IT180A
Panasonic R1755V

High Performance Low Dk/Df

EMC EM828, EM888(S), EM888(K)
Isola FR408, FR408HR
Isola l-Speed, l-Tera MT
Nelco N4000-13EP,EPSI
Panasonic R5775 Megtron 6

RF Materials

Rogers RO4350, RO3010
Taconic RF-30, RF-35, TLC, TLX, TLY
Taconic 601, 602, 603, 605

Halogen Free

EMC EM285, EM370(D)
Panasonic R1566

Aluminum Backed PCB

Shengyi SAR20, Yugu YGA

Additional Materials

Rigid Polimide: Shengyi SH260, Ventec VT901
BT Epoxy: Nelco and Mitsubishi
High CTI FR4: Shengyi S1600
Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi

Surface Finishes

Electroless Nickel Immersion Gold(ENIG)
Hot Air Solder Level (HASL, Lead and Lead-free)
OSP, Immersion Tin, Immersion Silver, ENEPIG
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold
Selective and Multiple surface Finishes, Carbon Ink, Peelable SM

PCB Technologies

Standard

Advanced

Standard

Advanced

Rigid-Flex & Flexible Circuits

Y

Y

Buried and Blind Vias

Y

Y

Sequential Lamination

Y

Y

Impedance Control

±10%

±5%

Hybrids & Mixed Dielectrics

Y

Y

Aluminum PCB’s

Y

Y

Non-Conductive Via Fill (VIP)

Y

Y

Conductive Via Fill

Y

Y

Cavity Boards

Y

Y

Backdrilling

Y

Y

Controlled Depth Drill and Rout

Y

Y

Edge Plating

Y

Y

Buried Capacitance

Y

Y

Etch Back

Y

Y

In-board Beveling

Y

Y

2-D Bar Code Printing

Y

Y

Standard Features

Standard

Advanced

Standard

Advanced

Maximum Layer Count

20

36

Maximum Panel Size

533x610mm
[21x24"]

610x1067mm
[24x42"]

Outer Layer Trace/Spacing(1/3oz starting foil+plating)

90μm/90μm
[0.0035"/0.0035"]

64μm/76μm
[0.0025"/0.003"]

Inner Layer Trace/Spacing(Hoz inner layer cu)

76μm/76μm
[0.003"/0.003"]

50μm/50μm
[0.002"/0.002"]

Maximum PCB Thickness

3.2mm[0.125"]

6.5mm[0.256"]

Minimum PCB Thickness

.20mm[0.008"]

.10mm[0.004"]

Minimum Mechancial Drill Size

.20mm[0.008"]

.10mm[0.004"]

Minimum Laser Drill Size

.10mm[0.004"]

.08mm[0.003"]

Maximum PCB Aspect Ratio

10:1

25:1

Maximum Copper Weight

5 oz[178μm]

6 oz[214μm]

Minimum Copper Weight

1/3 oz[12μm]

1/4 oz[9μm]

Minimum Core Thickness

50μm[0.002"]

38μm[0.0015"]

Minimum Dielectric Thickness

64μm[0.0025"]

38μm[0.0015"]

Minimum Pad Size Over Drill

0.46mm[0.018"]

0.4mm[0.016"]

Solder Mask Registration

±50μm[0.002"]

±38μm[0.0015"]

Minimum Solder Mask Dam

76μm[0.003"]

64μm[0.0025"]

Copper Feature to Edge, V-cut(30°)

0.40mm[0.016"]

0.36mm[0.014"]

Copper Feature to PCB Edge,Routed

0.25mm[0.010"]

0.20mm[0.008"]

Tolerance on Overall Dimensions

±100μm[0.004"]

±50μm[0.002"]

HDI Features

Standard

Advanced

Standard

Advanced

Minimum Microvia Hole Size

100μm[0.004"]

75μm[0.003"]

Capture Pad Size

0.25mm[0.010"]

0.20mm[0.008"]

Glass Reinforced Dielectrics

Y

Y

Maximum Aspect Ratio

0.7:1

1:1

Stacked Microvias

Y

Y

Copper Filled Microvias

Y

Y

Buried Filled Vias

Y

Y

Maximum No. of Buildup Layers

3+N+3

5+N+5

Adnanced Processes

Direct Imaging for Innerlayers, Outerlayers, and Soldermask
Direct Plating for High Layer Count and Microvias Products
Reverse Pulse Plating
Solid Copper Plated PTH Vias
XACT Tooling System for Improved Layer-to-Layer Registration
Spray Coating for Soldermask
Inkjet Printing for Legend
In-Line AOL for Outerlayers and AOI for Final Inspection
ORMETD Copper Paster for Any-layer Connections
ZETA Material for HDI and Low-Loss Applications

Quality System and Certifications

Adnanced ProcessesIPC Specs: IPC-A-600. IPC-6012, IPC-6013, IPC-6016 (Class 2 and class 3)

Quality System Certifications: ISO 9001:2008, TS16949:2009,ISO13485:2003

Environmental Certifications: ISO14001:2004, ISO/TS14067:2013
UL Certification: File number E229342